Company news

  • High-density interconnect HDI evolves into mSAP
    Post time: 07-09-2019

    There are many other trends in PCB production, all of which are related to the key manufacturing processes and will affect the development of HDI design. Most of today’s micro-through holes are formed by carbon dioxide lasers using established tools. One disadvantage of this process is that...Read more »

  • Key Process Control of High-rise Circuit Board
    Post time: 07-09-2019

    High-level circuit boards are generally defined as high-level multi-layer circuit boards with 10-20 or more layers. Compared with traditional multi-layer circuit boards, they are more difficult to process and require higher quality and reliability. They are mainly used in communication equipment,...Read more »