Six-layer first-order HDI Rigid-flex board
Layer : two-layer flexible board + four-layer rigid board
Minimum through aperture : 0.20mm buried via 0.15mm,blind via 0.10mm
Outer layer minimum conductor width/space : 0.10/0.10mm
Inner layer minimum conductor width/space : 0.07/0.07mm
Single-end mode impedance : 50oh±10%
Surface treatment : electro-less nickel immersion gold(ENIG)+double-sided green ink solder mask, nickel : 3-6UM, gold : 0.05-0.10UM
Finished board thickness : 0.8±0.1mm
Scope of application of products : TWS Bluetooth Headset